Thermal property evaluation of a 2.5D integration method with device level microchannel direct cooling for a high-power GaN HEMT device

• Tingting Lian,
• Yanming Xia,
• Zhizheng Wang,
• Xiaofeng Yang,
• Zhiwei Fu,
• Xin Kong,
• Shuxun Lin,
• Shenglin Ma

Affiliations

Tingting Lian

Department of Mechanical and Electrical Engineering, Xiamen University

Yanming Xia

Department of Mechanical and Electrical Engineering, Xiamen University

Zhizheng Wang

Department of Mechanical and Electrical Engineering, Xiamen University

Xiaofeng Yang

China Electronic Product Reliability and Environmental Testing Research Institute

Zhiwei Fu

China Electronic Product Reliability and Environmental Testing Research Institute

Xin Kong

The 29th Research Institute of China Electronics Technology Group Corporation

Shuxun Lin

Chengdu HiWafer Semiconductor Co., Ltd.

Shenglin Ma

Department of Mechanical and Electrical Engineering, Xiamen University