Ce effects on dynamic recrystallization and microstructure of the copper alloy under hot deformation behavior with different strain rate

Abstract

The Cu–Ni–Sn–Ti–Cr and Cu–Ni–Sn–Ti–Cr–Ce alloys were compressed at 500–900 °C with 0.001–10 s−1 strain rates using the Gleeble 1500 deformation simulator. The effects of Ce addition on the microstructure and recrystallized grains of Cu–Ni–Sn–Ti–Cr alloy were investigated using EBSD and TEM. A constitutive equation was established to calculate the activation energy for the alloy hot deformation, and the optimal processing parameters were obtained. The corresponding texture of the Cu–Ni–Sn–Ti–Cr–Ce alloy deformed at 800 °C with 0.01 s−1, 0.1 s−1 and 1 s−1 strain rates is the {112} Copper, {001} Cubic and {011} Goss texture. The texture of the Cu–Ni–Sn–Ti–Cr alloy deformed at 800 °C and 0.1 s−1 strain rate is the {011} Goss texture. The strain rate and Ce addition can change the alloy texture. The precipitation phase in Cu–Ni–Sn–Ti–Cr (-Ce) alloy is mainly CuNi2Ti phase, and the addition of Ce can promote the precipitation of fine nanoscale precipitation phase in the alloy. Moreover, the addition of Ce can promote the dynamic recrystallization of the alloy, but the dynamic recrystallization of the alloy is suppressed with the increase of the hot deformation rate at the heat deformation temperature of 800 °C.

Keywords

• Copper alloys
• Thermal deformation behavior
• Strain rate
• EBSD and TEM
• Dynamic recrystallization