Nature Communications (Oct 2023)

Process integration and future outlook of 2D transistors

  • Kevin P. O’Brien,
  • Carl H. Naylor,
  • Chelsey Dorow,
  • Kirby Maxey,
  • Ashish Verma Penumatcha,
  • Andrey Vyatskikh,
  • Ting Zhong,
  • Ande Kitamura,
  • Sudarat Lee,
  • Carly Rogan,
  • Wouter Mortelmans,
  • Mahmut Sami Kavrik,
  • Rachel Steinhardt,
  • Pratyush Buragohain,
  • Sourav Dutta,
  • Tristan Tronic,
  • Scott Clendenning,
  • Paul Fischer,
  • Ernisse S. Putna,
  • Marko Radosavljevic,
  • Matt Metz,
  • Uygar Avci

DOI
https://doi.org/10.1038/s41467-023-41779-5
Journal volume & issue
Vol. 14, no. 1
pp. 1 – 5

Abstract

Read online

The academic and industrial communities have proposed two-dimensional (2D) transition metal dichalcogenide (TMD) semiconductors as a future option to supplant silicon transistors at sub-10nm physical gate lengths. In this Comment, we share the recent progress in the fabrication of complementary metal-oxide-semiconductor (CMOS) devices based on stacked 2D TMD nanoribbons and specifically highlight issues that still need to be resolved by the 2D community in five crucial research areas: contacts, channel growth, gate oxide, variability, and doping. While 2D TMD transistors have great potential, more research is needed to understand the physical interactions of 2D materials at the atomic scale.