e-Polymers (Jul 2022)

Synthesis and properties of PI composite films using carbon quantum dots as fillers

  • Zhang Yuyin,
  • Guo Hongtao,
  • Jiang Shaohua,
  • Hu Zhaoyu,
  • Zha Guojun,
  • Liu Kunming,
  • Hou Haoqing

DOI
https://doi.org/10.1515/epoly-2022-0054
Journal volume & issue
Vol. 22, no. 1
pp. 577 – 584

Abstract

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Polyimide (PI) is widely used in the field of microelectronics because of its excellent thermal, mechanical, optical, and electrical properties. With the development of electronics and information industry, PI as a dielectric material needs to possess low dielectric loss. PI/carbon quantum dots (PI/CQDs) composite films with low dielectric loss were prepared by introducing CQDs into PI matrix. At 25°C and 1 kHz voltage, the dielectric loss of pure PI film is about 0.0057. The dielectric loss of PI/CQDs composite film is about 0.0018, which is about 68% lower than that of pure PI film. The dielectric loss of PI/CQD composite film is greatly reduced while the mechanical properties and thermal properties of PI/CQDs composite film roughly remain unchanged. Due to the cross-linking structure formed between CQDs and PI molecular chain, the relative movement of PI molecular chain is hindered.

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