Dual-stage corrosion mechanisms and antibacterial enhancement of Cu-Sn-P alloys with Si and Al microalloying in simulated body fluid

Lin Su; Wenbin Liu; Yangfan Liu; Yanbin Jiang; Yanggang Wang; Zhou Li; Kaiyu You; ChuYu Wang; Gengyan Liu

Materials & Design (Mar 2025)

Dual-stage corrosion mechanisms and antibacterial enhancement of Cu-Sn-P alloys with Si and Al microalloying in simulated body fluid

Lin Su,
Wenbin Liu,
Yangfan Liu,
Yanbin Jiang,
Yanggang Wang,
Zhou Li,
Kaiyu You,
ChuYu Wang,
Gengyan Liu

Affiliations

Lin Su: School of Materials Science and Engineering, Central South University, Changsha 410083, China
Wenbin Liu: Department of Orthopaedics, The Third Xiangya Hospital, Central South University, 138 Tongzipo Road, Changsha 410008, China; Hunan Engineering Research Center of Biomedical Metal and Ceramic Implants, Changsha, China
Yangfan Liu: School of Materials Science and Engineering, Central South University, Changsha 410083, China
Yanbin Jiang: School of Materials Science and Engineering, Central South University, Changsha 410083, China; State Key Lab for Powder Metallurgy, Central South University, Changsha 410083, China; Corresponding authors at: School of Materials Science and Engineering, Central South University, Changsha 410083, China (Y. Jiang).
Yanggang Wang: School of Materials Science and Engineering, Central South University, Changsha 410083, China
Zhou Li: School of Materials Science and Engineering, Central South University, Changsha 410083, China; State Key Lab for Powder Metallurgy, Central South University, Changsha 410083, China
Kaiyu You: School of Materials Science and Engineering, Central South University, Changsha 410083, China
ChuYu Wang: School of Materials Science and Engineering, Central South University, Changsha 410083, China
Gengyan Liu: Department of Orthopaedics, The Third Xiangya Hospital, Central South University, 138 Tongzipo Road, Changsha 410008, China; Corresponding authors at: School of Materials Science and Engineering, Central South University, Changsha 410083, China (Y. Jiang).

Journal volume & issue: Vol. 251
p. 113635

Abstract

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The effects of P, Si and Al elements on the microstructure, corrosion properties and antibacterial properties of copper-tin alloys were studied. The addition of Si and Al elements reduced the layer fault energy of Cu-Sn-P alloy, refined grain and increased twins. Cu-Sn-P-Si and Cu-Sn-P-Al alloys were prone to grain boundary stripping corrosion and twin corrosion, which promoted the release of copper ions and improved the antibacterial properties. Cu-Sn-P-Al alloy had the best antibacterial activity. These results provide theoretical guidance for the development of new antibacterial copper alloy materials by microalloying the corrosion and ion release behavior of copper alloys.

Published in Materials & Design

ISSN: 0264-1275 (Print); 1873-4197 (Online)
Publisher: Elsevier
Country of publisher: United Kingdom
LCC subjects: Technology: Electrical engineering. Electronics. Nuclear engineering: Materials of engineering and construction. Mechanics of materials
Website: https://www.journals.elsevier.com/materials-and-design

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