Guest Editorial: Nanopackaging Part II

Attila Bonyar; Brajesh Kumar Kaushik; James E. Morris; Markondeyaraj Pulugurtha

doi:10.1109/OJNANO.2022.3224652

IEEE Open Journal of Nanotechnology (Jan 2022)

Guest Editorial: Nanopackaging Part II

Attila Bonyar,
Brajesh Kumar Kaushik,
James E. Morris,
Markondeyaraj Pulugurtha

Affiliations

Attila Bonyar: Budapest University of Technology and Economics, Budapest, Hungary
Brajesh Kumar Kaushik: Indian Institute of Technology-Roorkee, Roorkee, India
James E. Morris: Portland State University, Portland, OR, USA
Markondeyaraj Pulugurtha: Florida International University, Miami, FL, USA

DOI: https://doi.org/10.1109/OJNANO.2022.3224652
Journal volume & issue: Vol. 3
pp. 166 – 168

Abstract

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The papers in this special section focus on nanopackaging. It begins with three reviews of diverse nanoscale technologies and then moves on to research papers focused primarily on nanomaterials for on-chip interconnect and noise abatement.

Published in IEEE Open Journal of Nanotechnology

ISSN: 2644-1292 (Online)
Publisher: IEEE
Country of publisher: United States
LCC subjects: Technology: Chemical technology; Technology: Electrical engineering. Electronics. Nuclear engineering
Website: https://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=8782713

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