Transient Liquid Phase Bonding of Copper Using Sn Coated Cu MWCNT Composite Powders for Power Electronics

Sri Harini Rajendran; Jung Do Hyun; Jeon Wook Sang; Jung Jae Pil

doi:10.3390/app9030529

Applied Sciences (Feb 2019)

Transient Liquid Phase Bonding of Copper Using Sn Coated Cu MWCNT Composite Powders for Power Electronics

Sri Harini Rajendran,
Jung Do Hyun,
Jeon Wook Sang,
Jung Jae Pil

Affiliations

Sri Harini Rajendran: Department of Materials Science and Engineering, University of Seoul, Seoul 130-743, Korea
Jung Do Hyun: Department of Materials Science and Engineering, University of Seoul, Seoul 130-743, Korea
Jeon Wook Sang: Department of Materials Science and Engineering, University of Seoul, Seoul 130-743, Korea
Jung Jae Pil: Department of Materials Science and Engineering, University of Seoul, Seoul 130-743, Korea

DOI: https://doi.org/10.3390/app9030529
Journal volume & issue: Vol. 9, no. 3
p. 529

Abstract

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In this paper, a novel transient liquid phase bonding material was fabricated by consequent electroless plating of Cu and Sn on a multi-walled carbon nanotube (MWCNT). The resulting Sn-Cu-MWCNT composites were used to join the Cu interconnects at 260°C. After 8 min of reflow time, a complete transformation of Cu3Sn intermetallic compound (IMC) occurred, leaving a Cu/MWCNT-Cu3Sn /Cu joint capable of withstanding the high operating temperature. Due to flake-like morphology, the Sn-Cu-MWCNT composite particles were well packed with lesser voids. The shear strength of the Cu/Cu3Sn-MWCNT/Cu joint was measured as 35.3 MPa, thus exhibiting the scope for replacing conventional transient liquid phase (TLP) powders in the future.

Published in Applied Sciences

ISSN: 2076-3417 (Online)
Publisher: MDPI AG
Country of publisher: Switzerland
LCC subjects: Technology: Engineering (General). Civil engineering (General); Science: Biology (General); Science: Physics; Science: Chemistry
Website: http://www.mdpi.com/journal/applsci

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