Investigation on crack propagation of SiCf/SiC composite via PF-CZM method

Abstract

SiCf/SiC composite materials had become a research hotspot in the fields of aerospace materials and nuclear materials in recent years. This materials have high strength, radiation resistance, high temperature resistance and oxidation resistance. However, SiC is a typical brittle material prone to being damaged due to stress concentration in some cases, leading to cracks and even component failure. Therefore, this study employed an accurate and efficient numerical simulation method, phase field cohesive zone method (PFCZM), to investigate the microscopic damage behavior of SiCf/SiC composite materials. This study aimed to illustrate the influence of the thickness of pyrolytic carbon (PyC) interface layer on the failure behavior of SiCf/SiC composite materials. Firstly, this study conducted relevant verification of PFCZM. Secondly, numerical simulations of crack initiation, crack propagation, and final damage were performed by establishing a representative volume element (RVE). Observing the simulation results, it was noted that at low strain, when PyC was thicker, the SiCf/SiC composite materials exhibited slight damage to both the SiC matrix and PyC interface. Conversely, when PyC was thinner, the SiCf/SiC composite materials displayed only slight damage to PyC interface. As the PyC thickness increases, the damage to PyC interface decreases, while the damage to SiC becomes more prominent. Simultaneously, a competitive relationship in the damage behavior of SiCf/SiC composite materials can be found after the SiC matrix has cracked: When PyC is thinner, the damage primarily manifests as interlayer delamination between the SiC matrix and the SiC fiber. Conversely, when PyC is thicker, it manifests in PyC failure. Finally, this study concluded that, in this investigation, a PyC interface layer with a thickness of 0.1 μm exhibited the most effective protective effect on SiCf/SiC composite material.

Keywords

• SiCf/SiC composite materials
• Crack propagation
• PF-CZM method
• Interface thickness