ZINC MICRO-ALLOYING ADDITIONS IN Sn-0.7Cu LEAD-FREE SOLDER ALLOYS. SHORT REVIEW

Abstract

Sn-Pb solder alloy has been replaced with lead-free solder alloys due to the negative effect for environment and human health. The additions of Zinc (Zn) micro-alloying element in Sn0.7Cu lead-free solder alloy were reported by several researchers in improving the performance of Sn-0.7Cu solder alloy. This paper reviews the research findings available on the additions of zinc micro-alloying in Sn-0.7Cu solder alloy. It can be concluded that zinc micro-alloying additions were reported to improve the mechanical properties, phase aanalysis and microstructure of the solder free solder joint.

Keywords

• Lead-free solder
• soldering
• intermetallic
• micro-alloying
• phase formation
• mechanical properties
• microstructure analysis
• review