Sn-Pd-Ni Electroplating on Bi2Te3-Based Thermoelectric Elements for Direct Thermocompression Bonding and Creation of a Reliable Bonding Interface

Abstract

The Sn-Ag-Cu-based solder paste screen-printing method has primarily been used to fabricate Bi2Te3-based thermoelectric (TE) modules, as Sn-based solder alloys have a low melting temperature (approximately 220℃) and good wettability with Cu electrodes. However, this process may result in uneven solder thickness when the printing pressure is not constant. Therefore, we suggested a novel direct-bonding method between the Bi2Te3-based TE elements and the Cu electrode by electroplating a 100 µm Sn/ 1.3 µm Pd/ 3.5 µm Ni bonding layer onto the Bi2Te3-based TE elements. It was determined that there is a problem with the amount of precipitation and composition depending on the pH change, and that the results may vary depending on the composition of Pd. Thus, double plating layers were formed, Ni/Pd, which were widely commercialized. The Sn/Pd/Ni electroplating was highly reliable, resulting in a bonding strength of 8 MPa between the thermoelectric and Cu electrode components, while the Pd and Ni electroplated layer acted as a diffusion barrier between the Sn layer and the Bi2Te3 TE. This process of electroplating Sn/Pd/Ni onto the Bi2Te3 TE elements presents a novel method for the fabrication of TE modules without using the conventional Sn-alloy-paste screen-printing method.

Keywords

• tin electroplating
• thermoelectric module
• thermocompression bonding
• bi2te3
• direct bonding