Nature Communications (Jan 2018)

Electrically reversible cracks in an intermetallic film controlled by an electric field

  • Z. Q. Liu,
  • J. H. Liu,
  • M. D. Biegalski,
  • J.-M. Hu,
  • S. L. Shang,
  • Y. Ji,
  • J. M. Wang,
  • S. L. Hsu,
  • A. T. Wong,
  • M. J. Cordill,
  • B. Gludovatz,
  • C. Marker,
  • H. Yan,
  • Z. X. Feng,
  • L. You,
  • M. W. Lin,
  • T. Z. Ward,
  • Z. K. Liu,
  • C. B. Jiang,
  • L. Q. Chen,
  • R. O. Ritchie,
  • H. M. Christen,
  • R. Ramesh

DOI
https://doi.org/10.1038/s41467-017-02454-8
Journal volume & issue
Vol. 9, no. 1
pp. 1 – 7

Abstract

Read online

Electric-field-induced cracks are generally detrimental to functionality of ferroelectric ceramics. Liu et al. use an intermetallic alloy and ferroelectric oxide junction to mediate the reversible formation of cracks at nanoscales, resulting in colossal electroresistance modulation for memory applications.