Curing Kinetics and TTT Diagram of High Temperature Resistance Bismaleimide Resin

Abstract

The curing kinetics of high temperature resistance bismaleimide resin was studied by dynamic DSC analysis, and the parameters of the curing reaction were obtained to establish a phenomenological model based on Kissinger and Crane equations. The relationship between glass transition temperature and curing degree was analyzed with isothermal DSC method based on DiBenedetto equation. Moreover, the relationship between gel-time and temperature was investigated by gelation disk. Finally, the time-temperature-transition (TTT) diagram was built to guide the process of the resin. Results show that appropriate pressure timing can be determined according to the TTT diagram. Thus, air in or between layers of prepreg can be eliminated effectively to prepare composites with good internal quality.

Keywords

• bismaleimide resin
• curing kinetics
• TTT diagram
• process optimization