Assembly technology of electronic components for e-textiles

Abstract

This article deals with the issue of assembling conventional SMD components on textile substrates using UV-curable non-conductive adhesives. This technology is easily applicable in the textile industry. It thus enables the easy and fast production of e-textiles that are equipped with conventional electronic components or even entire electronic modules. The article describes the principle of this innovative technology. Furthermore, comprehensive results of testing the effect of mechanical stress, chemical cleaning, and climatic changes on e-textiles with assembled SMD components on the change in contact resistance are presented here. The results show that this technology can be used for assembling and encapsulating SMD components on a textile substrate in the realization of e-textiles.

Keywords

• E-textile
• Non-conductive adhesive
• UV-curable adhesive
• SMD assembly technology
• Contact resistance