Crystals (Nov 2021)

Flow Stress Behavior and Microstructure Evolution of Austenitic Stainless Steel with Low Copper Content during Hot Compression Deformation

  • Huaying Li,
  • Lihong Gao,
  • Yaohui Song,
  • Lidong Ma,
  • Haitao Liu,
  • Juan Li,
  • Guanghui Zhao

DOI
https://doi.org/10.3390/cryst11111408
Journal volume & issue
Vol. 11, no. 11
p. 1408

Abstract

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In order to study the microstructure evolution and flow stress behavior of as cast antibacterial austenitic stainless steel containing 1.52 wt.% copper, Gleeble 3800 was used for thermal compression simulation test. Through OM and EBSD analysis, it is found that the dynamic recrystallization mechanism of thermal deformation is mainly discontinuous dynamic recrystallization. With the increase of deformation temperature and deformation rate, the proportion of recrystallization nucleation gradually increases. The growth of twins relies on recrystallization and, at the same time, promotes dynamic recrystallization. Considering the influence of strain on flow stress, the strain compensation Arrhenius model is established according to the obtained stress-strain curve, and high accuracy is obtained. The correlation coefficient and average relative absolute error are 0.979 and 7.066% respectively. These results provide basic guidance for the technology of microstructure control and excellent mechanical properties of antibacterial stainless steel.

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