Dianzi Jishu Yingyong (Sep 2019)

High-speed PCB circuit power integrity simulation analysis

  • Meng Xiangsheng,
  • Che Kai,
  • Li Xiaofeng,
  • Li Jiufa,
  • Li Suxuan,
  • He Xueqin

DOI
https://doi.org/10.16157/j.issn.0258-7998.190163
Journal volume & issue
Vol. 45, no. 9
pp. 50 – 52

Abstract

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Aiming at the increasingly complicated high-speed PCB power supply voltage fluctuation problem, a method based on PDN(Power Distribution Network) and target impedance co-simulation design is proposed for the 1.15 V power network. PI(Power Integrity) was studied. Mainly involved in two aspects:(1)DC analysis, by widening the copper area, reducing the return path and other measures to reduce the 1.15 V voltage drop from 9 mV to 2.5 mV, the temperature from 1.3 ℃ to 0.1 ℃, DC current density from 91.340 3 A/mm2 drops to 82.393 5 A/mm2;(2)AC analysis, from the resonance distribution and PDN input impedance analysis, add 22 μF decoupling capacitor at the 987.34 MHz resonance point to build a decoupling network to remove the risk point. The simulation results show that the method effectively reduces the risk of potential voltage fluctuation and target impedance mismatch in high-speed PCB circuits, thus improving the stability and reliability of the power system.

Keywords