Nondestructive testing method for a new generation of electronics

Abstract

The implementation of the Smart City system needs reliable and smoothly operating electronic equipment. The study is aimed at developing a nondestructive testing method for electronic equipment and its components. This method can be used to identify critical design defects of printed circuit boards (PCB) and to predict their service life, taking into account the nature of probable operating loads. The study uses an acoustic emission method to identify and localize critical design defects of printed circuit boards. Geometric dimensions of detected critical defects can be determined by the X-ray tomography method. Based on the results of the study, a method combining acoustic emission and X-ray tomography was developed for nondestructive testing of printed circuit boards. The stress-strain state of solder joints containing detected defects was analyzed. This paper gives an example of using the developed method for estimating the degree of damage to joints between PCB components and predicting the service life of the entire PCB.