Фізика і хімія твердого тіла (Jul 2019)

Kinetics of dispersion during annealing in vacuum of thin double nickel-silver films deposited onto oxide materials

  • I. I. Gab,
  • T. V. Stetsyuk,
  • B. D. Kostyuk,
  • D. B. Shakhnin

DOI
https://doi.org/10.15330/pcss.20.2.175-180
Journal volume & issue
Vol. 20, no. 2
pp. 175 – 180

Abstract

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The kinetics of dispersion of thin nickel-silver films deposited onto alumina and zirconia ceramics and annealed in vacuum at temperatures up to 1000 °C with different exposition times at each temperature (from 5 up to 20 min) was studied. The double films consisted of two layers: the first metallization layer was 150 nm nickel nanofilm deposited onto the oxide surface, and the second silver layer 1,5 mm thick deposited over the first one as a solder was used for joining of metallized oxide samples. It was found that these films remain rather dense during short-term heating up to 900 °C; and, after annealing at 950 °C and 1000 °C, they decompose immediately into individual droplets covering more than half the area of the ceramic substrates. The kinetic curves for the dispersion of these films were plotted.

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