Theoretical and experimental analysis of a venting clip to reduce stray inductance in high‐power conversion applications

Abstract

AbstractIn this study, we present a venting clip for high‐power applications that is intended to reduce stray inductance. To reduce the stray inductance of packages in high‐power applications, the proposed venting clip features slots are inserted onto a conventional clip. A conventional clip and the proposed venting clip were designed and fabricated to compare the respective stray inductance. The inductance of the proposed venting clip was approximately 15.8% than that of the conventional clip at a frequency of 100 kHz. Through a comparison between the conventional and venting clips, it is confirmed that the proposed venting clip is superior for high‐power applications in terms of decreasing inductance. With reduced inductance, the switching‐loss for such applications is also expected to decrease. Moreover, the impedance of the venting clip decreased by approximately 15.5% compared with that of the conventional clip at a frequency of 100 kHz. The venting clip, which has reduced resistive component, is also expected to decrease conduction loss in high‐power applications.

Keywords

• power conversion
• power module
• semiconductor package
• stray inductance
• venting clip