Laser direct sintering approach for additive manufacturing in flexible electronic

Abstract

Laser processing has proven to be a potential candidate. It provides a fast and non-destructive additive manufacturing method to produce highly conductive patterns on flexible substrates. In this work, we investigate the use of laser sintering of silver nanoparticle inks. The silver nanoparticle ink is inkjet printed on a flexible substrate and laser-sintered to obtain a highly conductive pattern. The results are of great significance to the large-scale development of cost-effective and environmentally friendly production methods for flexible electronic products.