AIP Advances (Oct 2020)

Effect of annealing on the electrophysical properties of CdTe/HgCdTe passivation interface by the capacitance–voltage characteristics of the metal–insulator–semiconductor structures

  • Xi Wang,
  • Kai He,
  • Xing Chen,
  • Yang Li,
  • Chun Lin,
  • Qinyao Zhang,
  • Zhenhua Ye,
  • Liwei Xin,
  • Guilong Gao,
  • Xin Yan,
  • Gang Wang,
  • Yiheng Liu,
  • Tao Wang,
  • Jinshou Tian

DOI
https://doi.org/10.1063/5.0021073
Journal volume & issue
Vol. 10, no. 10
pp. 105102 – 105102-4

Abstract

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The capacitance–voltage characteristics of metal–insulator–semiconductor structures based on Hg1−xCdxTe (x = 0.218) with CdTe passivation are studied before and after the passivation annealing process. We found that after vacuum annealing at 300 °C for 24 h, the micromorphology of the passivation layer was significantly improved, and as the fixed charge density decreased from 1.3 × 1012 cm−2 to 1.0 × 1010 cm−2, the fast surface state density decreased from 2 × 1013 cm−2 eV−1 to 3 × 1012 cm−2 eV−1, with a minimum value of 1.2 × 1011 cm−2 eV−1. From these findings, combined with the secondary ion mass spectroscopy analysis, we conclude that the annealing process propagates an equivalent electrical surface for CdTe/HgCdTe uniformly from the principal physical interface to the inside of the bulk material, effectively improving the characteristics of the CdTe passivation layer.