Mechanical properties and microstructure evolution of Sn–Bi-based solder joints by microalloying regulation mechanism

Abstract

Sn–Bi based solders are used in electronic packaging for interconnection processes. However, the rate of research on the comprehensive performance of solders is difficult to match the rapid development of advanced manufacturing of integrated circuits, resulting in the inability to obtain interconnect structures with excellent reliability for electronic devices. To demand a more effective modification method, we chose to dope 1.0 wt % In element in Sn58Bi–1Sb alloy. The strength, micromechanical properties and creep resistance of the solder were improved due to the combined effect of solid solution strengthening and diffusely distributed second phase strengthening. Furthermore, the addition of In element dramatically improved the thermal properties and wettability due to the generation of Bi3In5 intermetallic compounds (88.9 °C) and the activation energy of the solder wettability reaction was reduced to 247.36 J/mol. Notably, the addition of In element increased the amount of β-Sn phase deviation and decreased the Schmid factor value of β-Sn phase, resulting in a significant increase in the strength and micro-zone creep resistance. Under the action of current, a large amount of uniform Bi particle deviations and sub-crystalline structures persist in the β-Sn phase of the Sn58Bi–1Sb1In solder matrix. In the Cu/Sn58Bi–1Sb1In/Cu joints, many Bi particles are staggered in the β-Sn phase. Since the resistivity of the β-Sn phase is smaller than that of the Bi phase, the energization process leads to a possible further increase of the local currents at certain locations in the β-Sn phase, which reduces the electromigration resistance of the β-Sn phase. After energization, the biphasic twin structure with excellent electromigration resistance starts to degrade. The results show that the doping of In element comprehensively improves the performance of Sn58Bi–1Sb solder. It opens up a new idea for the design of alloying modification of tin-bismuth based solder.

Keywords

• Creep resistance
• Mechanical properties
• Wettability
• Microstructure