Evaluation of Microscopic Damage of PEEK Polymers under Cyclic Loadings Using Molecular Dynamics Simulations

Abstract

Full-atomic molecular dynamics simulations were conducted to investigate the time evolution of microscopic damage in polyetheretherketone (PEEK) polymers under cyclic loading conditions. Three characteristics were used to quantify microscopic damage: entropy, distribution of the end-to-end distance of polymers, and the volume fraction of voids. Our results show that the degree of disentanglement of polymers and the volume fraction of voids increase with cyclic loading, which may lead to entropy generation. Uniaxial tensile strength simulations of the polymer system before and after cyclic loading were performed. The tensile strength after cyclic loading was lower than that before loading. Furthermore, two systems with the same entropy and different loading histories showed almost the same strength. These results imply that entropy generation is expressed as the total microscopic damage and can potentially be employed for effective evaluation of the degradation of material characteristics.

Keywords

• molecular dynamics
• thermoplastic resin
• cyclic loading
• entropy
• void