Preface of 3rd IEEE International Conference on Electronic Communications, Internet of Things and Big Data 2023 (IEEE ICEIB 2023)

Teen-Hang Meen; Hsin-Hung Lin; Cheng-Fu Yang

doi:10.3390/engproc2023038088

Engineering Proceedings (Jul 2023)

Preface of 3rd IEEE International Conference on Electronic Communications, Internet of Things and Big Data 2023 (IEEE ICEIB 2023)

Teen-Hang Meen,
Hsin-Hung Lin,
Cheng-Fu Yang

Affiliations

Teen-Hang Meen: Department of Electronic Engineering, National Formosa University, Yunlin 632, Taiwan
Hsin-Hung Lin: Department of Creative Product Design, Asia University, Taichung 413, Taiwan
Cheng-Fu Yang: Department of Chemical and Materials Engineering, National University of Kaohsiung, Kaohsiung 811, Taiwan

DOI: https://doi.org/10.3390/engproc2023038088
Journal volume & issue: Vol. 38, no. 1
p. 88

Abstract

Read online

This volume represents the proceedings of the 3rd IEEE International Conference on Electronic Communications, Internet of Things, and Big Data 2023 (IEEE ICEIB 2023) [...]

n/a

Published in Engineering Proceedings

ISSN: 2673-4591 (Online)
Publisher: MDPI AG
Country of publisher: Switzerland
LCC subjects: Technology: Engineering (General). Civil engineering (General): Engineering machinery, tools, and implements
Website: https://www.mdpi.com/journal/engproc

About the journal

Abstract

Keywords