Active and Passive Electronic Components (Jan 1980)

Helium Leak Measurements as a Predictor of Hermetic Package Life in Surgically-implanted Microelectronic Devices

  • P. E. K. Donaldson

DOI
https://doi.org/10.1155/APEC.6.263
Journal volume & issue
Vol. 6, no. 3-4
pp. 263 – 263

Abstract

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