CMP Pad Conditioning Using the High-Pressure Micro-Jet Method

Xin Li; Yinggang Wang; Hongyu Chen; Wenhong Zhao; Qianfa Deng; Tengfei Yin; Suet To; Zhe Sun; Xi Shen; Wei Hang; Julong Yuan

doi:10.3390/mi14010200

Micromachines (Jan 2023)

CMP Pad Conditioning Using the High-Pressure Micro-Jet Method

Xin Li,
Yinggang Wang,
Hongyu Chen,
Wenhong Zhao,
Qianfa Deng,
Tengfei Yin,
Suet To,
Zhe Sun,
Xi Shen,
Wei Hang,
Julong Yuan

Affiliations

Xin Li: College of Mechanical Engineering, Zhejiang University of Technology, Hangzhou 310023, China
Yinggang Wang: College of Mechanical Engineering, Zhejiang University of Technology, Hangzhou 310023, China
Hongyu Chen: College of Mechanical Engineering, Zhejiang University of Technology, Hangzhou 310023, China
Wenhong Zhao: College of Mechanical Engineering, Zhejiang University of Technology, Hangzhou 310023, China
Qianfa Deng: College of Mechanical Engineering, Zhejiang University of Technology, Hangzhou 310023, China
Tengfei Yin: State Key Laboratory of Ultra-precision Machining Technology, Department of Industrial and Systems Engineering, The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong SAR, China
Suet To: State Key Laboratory of Ultra-precision Machining Technology, Department of Industrial and Systems Engineering, The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong SAR, China
Zhe Sun: College of Mechanical Engineering, Zhejiang University of Technology, Hangzhou 310023, China
Xi Shen: College of Mechanical Engineering, Zhejiang University of Technology, Hangzhou 310023, China
Wei Hang: College of Mechanical Engineering, Zhejiang University of Technology, Hangzhou 310023, China
Julong Yuan: College of Mechanical Engineering, Zhejiang University of Technology, Hangzhou 310023, China

DOI: https://doi.org/10.3390/mi14010200
Journal volume & issue: Vol. 14, no. 1
p. 200

Abstract

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In this study, in order to improve and restore the performance of the polishing pads and reduce the cost of chemical mechanical polishing, three types of material polishing pads, namely, polyurethane, damping cloth, and non-woven fabric, were selected for the experiment. Accordingly, each polishing pad was set up with diamond conditioner and high-pressure micro-jet (HPMJ) conditioning control experiments. Subsequently, the fluctuation ranges of the material removal rate on the three polishing pads were 2.73–3.75 μm/h, 1.38–1.99 μm/h, and 2.36–4.32 μm/h, respectively under the HPMJ conditioning method, while the fluctuation ranges of the material removal rate on the three polishing pads were 1.80–4.14 μm/h, 1.02–2.09 μm/h, and 1.78–5.88 μm/h under the diamond conditioning method. Comparing the polishing pad morphologies under SEM, we observed that the surface of the polishing pad after HPMJ conditioning was relatively clean, and the hole structure was not blocked. Contrastingly, there remained numerous abrasive particles on the surface after the conventional diamond conditioning and the hole structure was blocked. Thus, the HPMJ conditioning technology is better than the traditional diamond conditioning technology. Subsequently, the polishing pad after HPMJ conditioning has a longer service life and a more stable material removal rate than that after traditional diamond conditioning.

Published in Micromachines

ISSN: 2072-666X (Online)
Publisher: MDPI AG
Country of publisher: Switzerland
LCC subjects: Technology: Mechanical engineering and machinery
Website: https://www.mdpi.com/journal/micromachines

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