Direct metallization by a plasma coating process on thermal conductive polyamide

Abstract

This paper describes the metallization on highly filled thermal conductive Polyamide 6 material and the influence of the process conditions of the samples on the quality of the metal deposition. In a series of tests it is establish that the quality of the injection moulding process and fillers used for the polyamide material has a significant impact on the metal deposition on the polymeric surface. Even if the same surface roughness is generated by laser structuring the adhesion of the metallic particles decreases considerably as the quality of the polymeric surface is less perfect, i.e. when more fillers appear on the surface of the sample.