Effect of TiC Particles on the Properties of Copper Matrix Composites

Abstract

In this study, TiC particle-reinforced Cu-based composites were prepared by powder metallurgy and spark plasma sintering (SPS) techniques. The mechanical and electrical properties of TiC/Cu composites were analyzed in conjunction with micro-morphology. The results showed that: TiC was fully diffused in the Cu matrix at a sintering temperature of 900 °C. The micron-sized TiC particles were most uniformly distributed in the Cu matrix and had the best performance. At this time, the densification of 5 wt.% TiC/Cu composites reached 97.19%, and the conductivity, hardness, and compressive yield strength were 11.47 MS·m−1, 112.9 HV, and 162 MPa, respectively. The effect of TiC content on the overall properties of the composites was investigated at a sintering temperature of 900 °C. The TiC content of the composites was also found to have a significant influence on the overall properties of the composites. The best performance of the composites was obtained when the TiC mass fraction was 10%. The average values of density, hardness, yield strength and conductivity of the 10 wt.% TiC/Cu composites were 90.07%, 128.3 HV, 272 MPa and 9.98 MS·m−1, respectively. The yield strength was 272 MPa, and the compressive strain was 38.8%. With the increase in TiC content, although the yield strength increased, the brittleness increased due to more weak interfaces in the composites.

Keywords

• copper matrix composites
• TiC
• mechanical properties
• electrical conductivity
• yield strength
• densification