A universal packaging substrate for mechanically stable assembly of stretchable electronics

Yan Shao; Jianfeng Yan; Yinglin Zhi; Chun Li; Qingxian Li; Kaimin Wang; Rui Xia; Xinyue Xiang; Liqian Liu; Guoli Chen; Hanxue Zhang; Daohang Cai; Haochuan Wang; Xing Cheng; Canhui Yang; Fuzeng Ren; Yanhao Yu

doi:10.1038/s41467-024-50494-8

Nature Communications (Jul 2024)

A universal packaging substrate for mechanically stable assembly of stretchable electronics

Yan Shao,
Jianfeng Yan,
Yinglin Zhi,
Chun Li,
Qingxian Li,
Kaimin Wang,
Rui Xia,
Xinyue Xiang,
Liqian Liu,
Guoli Chen,
Hanxue Zhang,
Daohang Cai,
Haochuan Wang,
Xing Cheng,
Canhui Yang,
Fuzeng Ren,
Yanhao Yu

Affiliations

Yan Shao: Department of Materials Science and Engineering, Southern University of Science and Technology
Jianfeng Yan: Department of Materials Science and Engineering, Southern University of Science and Technology
Yinglin Zhi: Department of Materials Science and Engineering, Southern University of Science and Technology
Chun Li: Department of Materials Science and Engineering, Southern University of Science and Technology
Qingxian Li: Shenzhen Key Laboratory of Soft Mechanics & Smart Manufacturing, Department of Mechanics and Aerospace Engineering, Southern University of Science and Technology
Kaimin Wang: Department of Materials Science and Engineering, Southern University of Science and Technology
Rui Xia: Department of Materials Science and Engineering, Southern University of Science and Technology
Xinyue Xiang: Department of Materials Science and Engineering, Southern University of Science and Technology
Liqian Liu: Department of Materials Science and Engineering, Southern University of Science and Technology
Guoli Chen: Department of Materials Science and Engineering, Southern University of Science and Technology
Hanxue Zhang: Department of Materials Science and Engineering, Southern University of Science and Technology
Daohang Cai: Department of Materials Science and Engineering, Southern University of Science and Technology
Haochuan Wang: Department of Materials Science and Engineering, Southern University of Science and Technology
Xing Cheng: Department of Materials Science and Engineering, Southern University of Science and Technology
Canhui Yang: Shenzhen Key Laboratory of Soft Mechanics & Smart Manufacturing, Department of Mechanics and Aerospace Engineering, Southern University of Science and Technology
Fuzeng Ren: Department of Materials Science and Engineering, Southern University of Science and Technology
Yanhao Yu: Department of Materials Science and Engineering, Southern University of Science and Technology

DOI: https://doi.org/10.1038/s41467-024-50494-8
Journal volume & issue: Vol. 15, no. 1
pp. 1 – 11

Abstract

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Abstract Stretchable electronics commonly assemble multiple material modules with varied bulk moduli and surface chemistry on one packaging substrate. Preventing the strain-induced delamination between the module and the substrate has been a critical challenge. Here we develop a packaging substrate that delivers mechanically stable module/substrate interfaces for a broad range of stiff and stretchable modules with varied surface chemistries. The key design of the substrate was to introduce module-specific stretchability and universal adhesiveness by regionally tuning the bulk molecular mobility and surface molecular polarity of a near-hermetic elastic polymer matrix. The packaging substrate can customize the deformation of different modules while avoiding delamination upon stretching up to 600%. Based on this substrate, we fabricated a fully stretchable bioelectronic device that can serve as a respiration sensor or an electric generator with an in vivo lifetime of 10 weeks. This substrate could be a versatile platform for device assembly.

Published in Nature Communications

ISSN: 2041-1723 (Online)
Publisher: Nature Portfolio
Country of publisher: United Kingdom
LCC subjects: Science
Website: https://www.nature.com/ncomms/

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