Mathematical Biosciences and Engineering (Sep 2020)
Strain-induced packing transition of Ih Cu<sub>n</sub>@Ag<sub>55-n</sub>(n = 0, 1, 13, 43) clusters from atomic simulations
Abstract
Strain is of significance in packing transition, but the key structural information for metal nanoclusters is still limited. Atomic simulations using molecular dynamics (MD) were performed to explore the microscopic details of atomic packing transition in four icosahedral (Ih) Cun@Ag55-n clusters without or with different number of Cu core atoms. Analytical tools were used to demonstrate the packing transition including internal energy per atom, shape factor, pair distribution functions, and atomic stress as well as cross-sectional images. The simulation results showed the differences of strain distribution between the surface and interior regions of these clusters at elevated temperature, which affected the transition temperatures of these four clusters. The increasing temperature resulted in strong tensile strain in the surfaces and Cu/Ag interfaces, which decreased the packing transition from Ih configuration as well as the shape changes.
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