ELECTRODEPOSITION OF SOLDER BUMP TO SEMICONDUCTOR DEVICES

Abstract

Using nonstationary regimes electrolysis for electrodepositing silver solder bump semiconductor blocked has reduced lateral expansion of different height on the plate, to improve the qualitative characteristics of the product, increase the number of devices produced on a semiconductor wafer, and thereby improve process performance and achieve economies of precious metals.

Keywords

• серебряные электрохимические покрытия
• нестационарный электролиз
• объемные (столбиковые) выводы