npj Flexible Electronics (May 2023)

A new route to fabricate flexible, breathable composites with advanced thermal management capability for wearable electronics

  • Huibao Chen,
  • Yafei Ding,
  • Guimei Zhu,
  • Yu Liu,
  • Qun Fang,
  • Xue Bai,
  • Yan Zhao,
  • Xin Li,
  • Xingyi Huang,
  • Tong-Yi Zhang,
  • Baowen Li,
  • Bin Sun

DOI
https://doi.org/10.1038/s41528-023-00257-0
Journal volume & issue
Vol. 7, no. 1
pp. 1 – 9

Abstract

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Abstract Wearable electronics with miniaturization and high-power density call for devices with advanced thermal management capabilities, outstanding flexibility, and excellent permeability. However, it is difficult to achieve these goals simultaneously due to the conflict between high thermal conductivity and permeability and flexibility. Here, we report an approach to fabricate flexible, breathable composites with advanced thermal management capability by coating the boron nitride nanosheets (BNNSs) layer with high thermal conductivity on the grids of patterned electrospun thermoplastic polyurethane (TPU) fibrous mats. The composite exhibited a significant enhancement of thermal conductivity and preserved instinctive breathability simultaneously. When the composite was integrated into flexible devices, its saturating operating temperature dropped significantly compared to that of pure Ecoflex packaging. Moreover, the surface temperature fluctuation was less than 0.5 °C during more than 2000 cycles bending-releasing process. Finally, a prototype to fabricate wearable electronics with advanced thermal management capability was proposed.