Synthesis and Characterization of Chitosan Particles Loaded with Antioxidants Extracted from Chia (Salvia hispanica L.) Seeds

Abstract

Chia (Salvia hispanica L.) seeds contain antioxidants with great benefits for health and are widely used in the food industry. Antioxidants can be degraded by environmental factors, decreasing their biological activity. Their encapsulation in chitosan (CH) particles represents an alternative to protect them and increases their application. The encapsulation efficiency (%EE) of the antioxidants in the CH particles depends on the synthesis conditions. In this study, two methods for encapsulation of chia extract in chitosan particles were evaluated: method A, 0.05% CH in 1% acetic acid was mixed with 0.07% of tripolyphosphate (TPP) and method B, 0.3% CH in 2% acetic acid was mixed with 1% TPP. The results showed that the %EE decreased with the concentration of the extract, and the FTIR analysis suggested that the compounds of the extract were adsorbed on the surface of the particles. Dynamic light scattering and zeta potential analysis showed that the particles of method A are unstable and with a tendency to agglomerate, and the particles of method B are stable. The highest %EE was obtained with 0.2 mg·mL−1 (method A) and 1.0 mg·mL−1 (method B) of the extract. The higher loading capacity (%LC) (16–72%) was exhibited by the particles of method A. The best particle yield (62–69%) was observed for method B. The particles with the extract adsorbed showed antioxidant activity (5–60%) at 25°C; however, in the particles with the extract encapsulated, the activity increased after subjecting to acidic conditions at 40°C due to the breakdown of the particles. The results obtained will allow choosing the appropriate conditions for the synthesis of chitosan particles loaded with chia extracts with specific characteristics (%EE, %LC, size, and type) according to their future applications. The particles could be used in food and pharmaceutical industries and even in edible films for food packaging.