High-Sensitivity Pressure Sensors Based on a Low Elastic Modulus Adhesive

Abstract

With the rapid development of intelligent applications, the demand for high-sensitivity pressure sensor is increasing. However, the simple and efficient preparation of an industrial high-sensitivity sensor is still a challenge. In this study, adhesives with different elastic moduli are used to bond pressure-sensitive elements of double-sided sensitive grids to prepare a highly sensitive and fatigue-resistant pressure sensor. It was observed that the low elastic modulus adhesive effectively produced tensile and compressive strains on both sides of the sensitive grids to induce greater strain transfer efficiency in the pressure sensor, thus improving its sensitivity. The sensitivity of the sensor was simulated by finite element analysis to verify that the low elastic modulus adhesive could enhance the sensitivity of the sensor up to 12%. The preparation of high-precision and fatigue-resistant pressure sensors based on low elastic modulus, double-sided sensitive grids makes their application more flexible and convenient, which is urgently needed in the miniaturization and integration electronics field.

Keywords

• adhesives
• high sensitivity
• low elastic modulus
• pressure sensors