On-chip mechanical computing: status, challenges, and opportunities

Luming Wang; Pengcheng Zhang; Zuheng Liu; Zenghui Wang; Rui Yang

Chip (Mar 2023)

On-chip mechanical computing: status, challenges, and opportunities

Luming Wang,
Pengcheng Zhang,
Zuheng Liu,
Zenghui Wang,
Rui Yang

Affiliations

Luming Wang: Institute of Fundamental and Frontier Sciences, University of Electronic Science and Technology of China, Chengdu 610054, China
Pengcheng Zhang: University of Michigan–Shanghai Jiao Tong University Joint Institute, Shanghai Jiao Tong University, Shanghai 200240, China
Zuheng Liu: University of Michigan–Shanghai Jiao Tong University Joint Institute, Shanghai Jiao Tong University, Shanghai 200240, China
Zenghui Wang: Institute of Fundamental and Frontier Sciences, University of Electronic Science and Technology of China, Chengdu 610054, China; State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, China; Corresponding author at: Institute of Fundamental and Frontier Sciences, University of Electronic Science and Technology of China, Chengdu, China.
Rui Yang: University of Michigan–Shanghai Jiao Tong University Joint Institute, Shanghai Jiao Tong University, Shanghai 200240, China; School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai 200240, China; Corresponding author at: University of Michigan–Shanghai Jiao Tong University Joint Institute, Shanghai Jiao Tong University, Shanghai 200240, China.

Journal volume & issue: Vol. 2, no. 1
p. 100038

Abstract

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ABSTRACT: With increasing challenges towards continued scaling and improvement in performance faced by electronic computing, mechanical computing has started to attract growing interests. Taking advantage of the mechanical degree of freedom in solid state devices, micro/nano-electromechanical systems (MEMS/NEMS) could provide alternative solutions for future computing and memory systems with ultralow power consumption, compatibility with harsh environments, and high reconfigurability. In this review, MEMS/NEMS-enabled memories and logic processors were surveyed, and the prospects and challenges for future on-chip mechanical computing were also analyzed.

Published in Chip

ISSN: 2709-4723 (Print); 2772-2724 (Online)
Publisher: Elsevier
Country of publisher: Netherlands
LCC subjects: Technology: Technology (General): Industrial engineering. Management engineering: Information technology
Website: https://www.sciencedirect.com/journal/chip

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