Физико-химические аспекты изучения кластеров, наноструктур и наноматериалов (Dec 2018)

Wetting of aluminum and copper substrates by lead – nickel melt

  • A.Kh. Shermetov,
  • A.A. Shokarov,
  • M.Kh. Ponezhev,
  • A.V. Sozaev,
  • B.S. Karamurzov

DOI
https://doi.org/10.26456/pcascnn/2018.10.671
Journal volume & issue
no. 10
pp. 671 – 676

Abstract

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In this paper, the task of obtaining new solders for brazing nickel and its alloys. Polyterms of wetting angle for Pb − Ni melts in the range from the melting point to 940 K on copper substrates and up to 900 K on aluminum were studied and wetting thresholds were detected: wetting of copper substrates starts at 640 K, and aluminum substrates are not wetted by the abovemelts.

Keywords