Joining mechanism of connection between Ag-plated Kovar interconnector and stranded Ag-plated Cu wire produced via parallel gap resistance welding

Yuhan Ding; Bo Zhang; Chen Shen; Nannan Chen; Jusha Ma; Kanglong Wu; Yi Wei; Lin Wang; Bin Qian; Xueming Hua

Materials Letters: X (Sep 2023)

Joining mechanism of connection between Ag-plated Kovar interconnector and stranded Ag-plated Cu wire produced via parallel gap resistance welding

Yuhan Ding,
Bo Zhang,
Chen Shen,
Nannan Chen,
Jusha Ma,
Kanglong Wu,
Yi Wei,
Lin Wang,
Bin Qian,
Xueming Hua

Affiliations

Yuhan Ding: Shanghai Key Laboratory of Materials Laser Processing and Modification, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, China
Bo Zhang: Shanghai Institute of Space Power Sources, Shanghai 200245, China
Chen Shen: Shanghai Key Laboratory of Materials Laser Processing and Modification, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, China; Corresponding authors.
Nannan Chen: Shanghai Institute of Space Power Sources, Shanghai 200245, China
Jusha Ma: Shanghai Institute of Space Power Sources, Shanghai 200245, China
Kanglong Wu: Shanghai Key Laboratory of Materials Laser Processing and Modification, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, China
Yi Wei: Shanghai Institute of Space Power Sources, Shanghai 200245, China
Lin Wang: Shanghai Key Laboratory of Materials Laser Processing and Modification, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, China
Bin Qian: Shanghai Institute of Space Power Sources, Shanghai 200245, China
Xueming Hua: Shanghai Key Laboratory of Materials Laser Processing and Modification, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, China; Corresponding authors.

Journal volume & issue: Vol. 19
p. 100209

Abstract

Read online

A space solar array includes GaAs solar cell, interconnector, and stranded Cu wire. Due to the preferential high working efficiency, the assembly of solar array is mostly performed using parallel gap resistance welding (PGRW). Since strengthening of the PGRW joints is the key to further extend service life of solar array, it is necessary to elucidate joining mechanism of each connection. In the present research, to clarify the controversy over PGRW joining mechanism between Ag-plated Kovar interconnector and stranded Ag-plated Cu wire, various advanced material characterization methods are conducted to joining interfaces. Experimental results confirm that, in addition to the known Ag/Cu eutectic interface, solid evidence of metallurgy bonding is also found in Cu/Cu interface. Such finding has significant implication for further enlarge the PGRW process window and produce stronger joints.

Published in Materials Letters: X

ISSN: 2590-1508 (Online)
Publisher: Elsevier
Country of publisher: Netherlands
LCC subjects: Technology: Electrical engineering. Electronics. Nuclear engineering: Materials of engineering and construction. Mechanics of materials
Website: https://www.journals.elsevier.com/materials-letters-x

About the journal

Abstract

Keywords