EPJ Web of Conferences (Jan 2022)
Optimization of grinding processes on fused silica components using in-process vibrometry and dynamometer measurements
Abstract
The presented investigations deal with real-time evaluation and recording of vibrations and forces during a CNC grinding process, as well as the analysis and control of process influences on the surface quality of optical components. The experiments were carried out on a 5-axis CNC machine. Rapid subsequent analysis of the topography resulting from grinding is achieved with the aid of white light interferometry. The aim of the investigations is to reduce the surface deviations (roughness, mid-spatials, waviness) influenced by process factors. It is shown that the vibration data measured during the grinding process correlate to a high degree with the recorded topography data.