Impedance Bandwidth Improvement of a Planar Antenna Based on Metamaterial-Inspired T-Matching Network

Mohammad Alibakhshikenari; Bal S. Virdee; Pancham Shukla; Yan Wang; Leyre Azpilicueta; Mohammad Naser-Moghadasi; Chan Hwang See; Issa Elfergani; Chemseddine Zebiri; Raed A. Abd-Alhameed; Isabelle Huynen; Jonathan Rodriguez; Tayeb A. Denidni; Francisco Falcone; Ernesto Limiti

doi:10.1109/ACCESS.2021.3076975

IEEE Access (Jan 2021)

Impedance Bandwidth Improvement of a Planar Antenna Based on Metamaterial-Inspired T-Matching Network

Mohammad Alibakhshikenari,
Bal S. Virdee,
Pancham Shukla,
Yan Wang,
Leyre Azpilicueta,
Mohammad Naser-Moghadasi,
Chan Hwang See,
Issa Elfergani,
Chemseddine Zebiri,
Raed A. Abd-Alhameed,
Isabelle Huynen,
Jonathan Rodriguez,
Tayeb A. Denidni,
Francisco Falcone,
Ernesto Limiti

Affiliations

Mohammad Alibakhshikenari: ORCiD; Electronic Engineering Department, University of Rome “Tor Vergata,”, Rome, Italy
Bal S. Virdee: ORCiD; Center for Communications Technology, London Metropolitan University, London, U.K.
Pancham Shukla: ORCiD; Center for Communications Technology, London Metropolitan University, London, U.K.
Yan Wang: ORCiD; Key Laboratory of Electronic Equipment Structure Design, Ministry of Education, Xidian University, Xi’an, China
Leyre Azpilicueta: ORCiD; School of Engineering and Sciences, Tecnologico de Monterrey, Monterrey, Mexico
Mohammad Naser-Moghadasi: ORCiD; Department of Electrical and Computer Engineering, Science and Research Branch, Islamic Azad University, Tehran, Iran
Chan Hwang See: ORCiD; School of Engineering and the Built Environment, Edinburgh Napier University, Edinburgh, U.K.
Issa Elfergani: ORCiD; Faculty of Engineering and Informatics, University of Bradford, Bradford, U.K.
Chemseddine Zebiri: ORCiD; Department of Electronics Engineering, Laboratoire d’Electronique de Puissance et Commande Industrielle (LEPCI), University of Ferhat Abbas, Sétif, Algeria
Raed A. Abd-Alhameed: ORCiD; Faculty of Engineering and Informatics, University of Bradford, Bradford, U.K.
Isabelle Huynen: ORCiD; Institute of Information and Communication Technologies, Electronics and Applied Mathematics, Université Catholique de Louvain, Louvain-la-Neuve, Belgium
Jonathan Rodriguez: ORCiD; Instituto de Telecomunicações, Campus Universitário de Santiago, Aveiro, Portugal
Tayeb A. Denidni: ORCiD; Institut National de la Recherche Scientifique (INRS), University of Quebec, Montréal, QC, Canada
Francisco Falcone: ORCiD; Electric, Electronic and Communication Engineering Department, Public University of Navarre, Pamplona, Spain
Ernesto Limiti: ORCiD; Electronic Engineering Department, University of Rome “Tor Vergata,”, Rome, Italy

DOI: https://doi.org/10.1109/ACCESS.2021.3076975
Journal volume & issue: Vol. 9
pp. 67916 – 67927

Abstract

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In this paper a metamaterial-inspired T-matching network is directly imbedded inside the feedline of a microstrip antenna to realize optimum power transfer between the front-end of an RF wireless transceiver and the antenna. The proposed T-matching network, which is composed of an arrangement of series capacitor, shunt inductor, series capacitor, exhibits left-handed metamaterial characteristics. The matching network is first theoretically modelled to gain insight of its limitations. It was then implemented directly in the 50- $\Omega $ feedline to a standard circular patch antenna, which is an unconventional methodology. The antenna’s performance was verified through measurements. With the proposed technique there is 2.7 dBi improvement in the antenna’s radiation gain and 12% increase in the efficiency at the center frequency, and this is achieved over a significantly wider frequency range by a factor of approximately twenty. Moreover, there is good correlation between the theoretical model, method of moments simulation, and the measurement results.

Published in IEEE Access

ISSN: 2169-3536 (Online)
Publisher: IEEE
Country of publisher: United States
LCC subjects: Technology: Electrical engineering. Electronics. Nuclear engineering
Website: https://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=6287639

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