Study on Temperature and Thermal Stress of Fused Silica Micropores in Laser Processing

Abstract

To study the laser processing of fused silica microchannels, the temperature and thermal stress of fused silica micropores irradiated by TEM00, TEM01 and Flat-top three modes were simulated. The morphology of the micropores was analyzed and the simulation results were compared. The results show that the spatial distribution of the laser intensity and the morphology of the micropores would all affect the temperature distribution and stress distribution of the material; the temperature accumulation effect is obvious, and the temperature continues to increase after continuous pulse action, in some mode, under light beam irradiation the focus area temperature exceeds the melting temperature of the material; the temperature gradient results in generating of thermal stress, which can cause damage if it exceeds the mechanical threshold of the material. The simulation results provide a useful reference for fused silica microchannel processing.