Crack initiation site at the interface between a nano-component and substrate

Van Lich LE; Takashi SUMIGAWA; Van Truong DO; Takayuki KITAMURA

doi:10.1299/mej.2014smm0048

Mechanical Engineering Journal (Oct 2014)

Crack initiation site at the interface between a nano-component and substrate

Van Lich LE,
Takashi SUMIGAWA,
Van Truong DO,
Takayuki KITAMURA

Affiliations

Van Lich LE: Department of Mechanical Engineering and Science, Graduate School of Engineering Kyoto University
Takashi SUMIGAWA: Department of Mechanical Engineering and Science, Graduate School of Engineering Kyoto University
Van Truong DO: Department of Design of Machinery & Robots, School of Mechanical Engineering Hanoi University of Science and Technology
Takayuki KITAMURA: Department of Mechanical Engineering and Science, Graduate School of Engineering Kyoto University

DOI: https://doi.org/10.1299/mej.2014smm0048
Journal volume & issue: Vol. 1, no. 5
pp. SMM0048 – SMM0048

Abstract

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In order to determine the effect of triple junction on the crack initiation, we use the finite element method to investigate the effect of misorientation between Cu grains on the stress concentration near the triple junction in comparison to that near a free edge. The results reveal that the triple junction represents a greater danger for crack initiation than the free edge in nano-components over a wide range of grain combinations. The stress concentration near the triple junction is governed by the difference in stiffness between the grains. Thus, the combination of the stiffest and softest grains induces the highest stress concentration.

Published in Mechanical Engineering Journal

ISSN: 2187-9745 (Online)
Publisher: The Japan Society of Mechanical Engineers
Country of publisher: Japan
LCC subjects: Technology: Mechanical engineering and machinery
Website: https://www.jstage.jst.go.jp/browse/mej/-char/en

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