Nature Communications (May 2016)

Tunnel electroresistance through organic ferroelectrics

  • B. B. Tian,
  • J. L. Wang,
  • S. Fusil,
  • Y. Liu,
  • X. L. Zhao,
  • S. Sun,
  • H. Shen,
  • T. Lin,
  • J. L. Sun,
  • C. G. Duan,
  • M. Bibes,
  • A. Barthélémy,
  • B. Dkhil,
  • V. Garcia,
  • X. J. Meng,
  • J. H. Chu

DOI
https://doi.org/10.1038/ncomms11502
Journal volume & issue
Vol. 7, no. 1
pp. 1 – 6

Abstract

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Ferroelectric organic materials can be used for tunnel barriers in memory devices as a cheaper and eco-friendly replacement of their inorganic counterparts. Here, Tian et al. use poly(vinylidene fluoride) with 1–2 layer thickness to achieve giant tunnel electroresistance of 1,000% at room temperature.