Development of a MEMS Multisensor Chip for Aerodynamic Pressure Measurements

Abstract

The existing instruments for aerodynamic pressure measurements are usually built around an array of discrete pressure sensors, placed in the same housing together with a few discrete temperature sensors. However, this approach is limiting, especially regarding miniaturization, sensor matching, and thermal coupling. In this work, we intend to overcome these limitations by proposing a novel MEMS multisensor chip, which has a monolithically integrated matrix of four piezoresistive MEMS pressure-sensing elements and two resistive temperature-sensing elements. After finishing the preliminary chip design, we performed computer simulations in order to assess its mechanical behavior when measured pressure is applied. Subsequently, the final chip design was completed, and the first batch was fabricated. The used technological processes included photolithography, thermal oxidation, diffusion, sputtering, micromachining (wet chemical etching), anodic bonding, and wafer dicing.

Keywords

• MEMS multisensor
• pressure sensing
• chip fabrication