Nano-Micro Letters (Feb 2024)
The Roadmap of 2D Materials and Devices Toward Chips
- Anhan Liu,
- Xiaowei Zhang,
- Ziyu Liu,
- Yuning Li,
- Xueyang Peng,
- Xin Li,
- Yue Qin,
- Chen Hu,
- Yanqing Qiu,
- Han Jiang,
- Yang Wang,
- Yifan Li,
- Jun Tang,
- Jun Liu,
- Hao Guo,
- Tao Deng,
- Songang Peng,
- He Tian,
- Tian-Ling Ren
Affiliations
- Anhan Liu
- School of Integrated Circuits and Beijing National Research Center for Information Science and Technology (BNRist), Tsinghua University
- Xiaowei Zhang
- School of Integrated Circuits and Beijing National Research Center for Information Science and Technology (BNRist), Tsinghua University
- Ziyu Liu
- School of Microelectronics, Fudan University
- Yuning Li
- School of Electronic and Information Engineering, Beijing Jiaotong University
- Xueyang Peng
- High-Frequency High-Voltage Device and Integrated Circuits R&D Center, Institute of Microelectronics, Chinese Academy of Sciences
- Xin Li
- State Key Laboratory of Dynamic Measurement Technology, Shanxi Province Key Laboratory of Quantum Sensing and Precision Measurement, North University of China
- Yue Qin
- State Key Laboratory of Dynamic Measurement Technology, Shanxi Province Key Laboratory of Quantum Sensing and Precision Measurement, North University of China
- Chen Hu
- High-Frequency High-Voltage Device and Integrated Circuits R&D Center, Institute of Microelectronics, Chinese Academy of Sciences
- Yanqing Qiu
- High-Frequency High-Voltage Device and Integrated Circuits R&D Center, Institute of Microelectronics, Chinese Academy of Sciences
- Han Jiang
- School of Microelectronics, Fudan University
- Yang Wang
- School of Microelectronics, Fudan University
- Yifan Li
- School of Integrated Circuits and Beijing National Research Center for Information Science and Technology (BNRist), Tsinghua University
- Jun Tang
- State Key Laboratory of Dynamic Measurement Technology, Shanxi Province Key Laboratory of Quantum Sensing and Precision Measurement, North University of China
- Jun Liu
- State Key Laboratory of Dynamic Measurement Technology, Shanxi Province Key Laboratory of Quantum Sensing and Precision Measurement, North University of China
- Hao Guo
- State Key Laboratory of Dynamic Measurement Technology, Shanxi Province Key Laboratory of Quantum Sensing and Precision Measurement, North University of China
- Tao Deng
- School of Electronic and Information Engineering, Beijing Jiaotong University
- Songang Peng
- High-Frequency High-Voltage Device and Integrated Circuits R&D Center, Institute of Microelectronics, Chinese Academy of Sciences
- He Tian
- School of Integrated Circuits and Beijing National Research Center for Information Science and Technology (BNRist), Tsinghua University
- Tian-Ling Ren
- School of Integrated Circuits and Beijing National Research Center for Information Science and Technology (BNRist), Tsinghua University
- DOI
- https://doi.org/10.1007/s40820-023-01273-5
- Journal volume & issue
-
Vol. 16,
no. 1
pp. 1 – 96
Abstract
Highlights This review introduces the potential of 2D electronics for post-Moore era and discusses their current progress in digital circuits, analog circuits, heterogeneous integration, sensing circuits, artificial intelligence chips, and quantum chips in sequence. A comprehensive analysis of the current trends and challenges encountered in the development of 2D materials is summarized. An in-depth roadmap outlining the future development of 2D electronics is presented, and the most accessible and promising avenues for 2D electronics are suggested.
Keywords
