Jixie qiangdu (Jan 2016)
STUDY ON CHIP COMPONENT NO-FILLET SOLDER JOINT STRESS AND STRAIN UNDER THERMAL CYCLE
Abstract
The chip component no-fillet solder joints finite element analysis models were set up. The influences of pad length,pad width,solder joint volume and solder joint material on the stress and strain distribution on no-fillet solder joints were analyzed under the thermal cyclic loading. The results show that the maximum strain and strain distribution in the chip component no-fillet solder joint are larger than that of the chip component solder joint with the fillet. On the condition of only changing the pad length,pad width,solder joint volume respectively,the maximum stress and strain in the chip component no-fillet solder joint increase with the increase of the pad length and the solder joint volume respectively,whereas reduce with the increase of the pad width. For the solder joint material of Sn63Pb37,Sn62Pb36Ag2,SAC305 and SAC387,the lead free SAC305 no-fillet solder joint has the minimum stress and strain under the same condition.
