Solids (Dec 2023)

Surface Characterization and Bulk Property Analysis of Aluminum Powders Treated with Hydrophobic Coatings: Stearic Acid and Phenyl-Phosphonic Acid

  • Bellamarie Ludwig

DOI
https://doi.org/10.3390/solids5010001
Journal volume & issue
Vol. 5, no. 1
pp. 1 – 13

Abstract

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Stearic and phenyl-phosphonic acids were applied to fine aluminum particles to understand their effect on the surface chemical composition and bulk properties of the surface-treated powders. During the solution phase deposition process, the surface composition changes chemically through a condensation reaction between the acid and particle surface hydroxyl groups, forming covalent chemical bonds. The retention of both types of acids was verified through characterization using Fourier transform infrared spectroscopy (FTIR) and X-ray photoelectron spectroscopy (XPS). The presence of stearic acid on the particle surface was observed through signature absorbance peaks, including interfacial C-O bonding modes, carboxylate, and carbonyl moieties, all present on both the treated powder. Spectra using XPS showed an increase in -CH relative intensity signal on the particle surface when compared to the raw material when considering the the carbon 2p photoelectron peak. Similar findings confirmed the presence of the phenyl-phosphonic acid when comparing to the raw material. The IR spectrum confirmed the presence of P-O-Al, P-O, and phosponates as a result of the surface bonding between the reagent and particles. XPS always provided evidence through the presence of phosphorous 2p and 2s photoelecton peaks at 191.3 and 133.4 eV, respectively. The bulk properties of both surface treated powders improved, as shown through improved apparent/tap density and a decreased Hausner Ratio (Group C to Group A behavior). Rheological characterization provided additional evidence by showing a reduced specific energy, flow rate index, and cohesion. The particle packing was improved as evidenced through reduced compressibility as a function of applied normal stress.

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