Influence of PUB2 on the Leveling Effect of Chip Copper Connection Electroplating: Mechanism and Applications

• Lanfeng Guo,
• Renlong Liu,
• Zhaobo He,
• Shaoping Li,
• Tong Tan,
• Changyuan Tao

Affiliations

Lanfeng Guo

School of Chemistry and Chemical Engineering, Chongqing University, Chongqing, China

Renlong Liu

School of Chemistry and Chemical Engineering, Chongqing University, Chongqing, China

Zhaobo He

Hubei Sinophorus Electronic Materials Co., Ltd., Hubei, China

Shaoping Li

Hubei Sinophorus Electronic Materials Co., Ltd., Hubei, China

Tong Tan

School of Chemistry and Chemical Engineering, Chongqing University, Chongqing, China

Changyuan Tao

School of Chemistry and Chemical Engineering, Chongqing University, Chongqing, China