Synthesis of Imidazole-Compound-Coated Copper Nanoparticles with Promising Antioxidant and Sintering Properties

Yu Zhang; Xianchong Yu; Ziyuan Chen; Song Wu; Haiqi Lai; Shiwo Ta; Tingyu Lin; Guannan Yang; Chengqiang Cui

doi:10.3390/mi14112079

Micromachines (Nov 2023)

Synthesis of Imidazole-Compound-Coated Copper Nanoparticles with Promising Antioxidant and Sintering Properties

Yu Zhang,
Xianchong Yu,
Ziyuan Chen,
Song Wu,
Haiqi Lai,
Shiwo Ta,
Tingyu Lin,
Guannan Yang,
Chengqiang Cui

Affiliations

Yu Zhang: State Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, Guangdong University of Technology, Guangzhou 510006, China
Xianchong Yu: State Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, Guangdong University of Technology, Guangzhou 510006, China
Ziyuan Chen: State Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, Guangdong University of Technology, Guangzhou 510006, China
Song Wu: State Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, Guangdong University of Technology, Guangzhou 510006, China
Haiqi Lai: State Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, Guangdong University of Technology, Guangzhou 510006, China
Shiwo Ta: State Key Laboratory of Advanced Materials and Electronic Components, Fenghua Advanced Technology Co., Ltd., Zhaoqing 526020, China
Tingyu Lin: Guangdong Fozhixin Microelectronics Technology Research Co., Ltd., Foshan 528200, China
Guannan Yang: State Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, Guangdong University of Technology, Guangzhou 510006, China
Chengqiang Cui: State Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, Guangdong University of Technology, Guangzhou 510006, China

DOI: https://doi.org/10.3390/mi14112079
Journal volume & issue: Vol. 14, no. 11
p. 2079

Abstract

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In this study, we present a facile method for preparing oxidation-resistant Cu nanoparticles through a liquid-phase reduction with imidazole compounds (imidazole, 2-methylimidazole, 2-phenylimidazole, and benzimidazole) that serve as protective and dispersing agents. Through a complexation reaction between Cu atoms, the imidazole compounds can form a protective film on the Cu nanoparticles to prevent the particles from rapidly oxidizing. We compared the effects of the four kinds of imidazole compounds on the oxidation resistance and sintering properties of Cu particles. The Cu particles prepared with benzimidazole could be stored in the air for 30 days without being oxidized. After sintering at 300 °C and 2 MPa, the joint of the particles could reach a shear strength of 32 MPa, which meets the requirements for microelectronic packaging.

Published in Micromachines

ISSN: 2072-666X (Online)
Publisher: MDPI AG
Country of publisher: Switzerland
LCC subjects: Technology: Mechanical engineering and machinery
Website: https://www.mdpi.com/journal/micromachines

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