Elucidation of Adhesive Interaction between the Epoxy Molding Compound and Cu Lead Frames

• Naoaki Tsurumi,
• Yuta Tsuji,
• Noriyuki Masago,
• Kazunari Yoshizawa

Affiliations

Naoaki Tsurumi

Research and Development Center, ROHM Co., Ltd., Kyoto, Japan

Yuta Tsuji

Institute for Materials Chemistry and Engineering and IRCCS, Kyushu University, Fukuoka, Japan

Noriyuki Masago

Research and Development Center, ROHM Co., Ltd., Kyoto, Japan

Kazunari Yoshizawa

Institute for Materials Chemistry and Engineering and IRCCS, Kyushu University, Fukuoka, Japan