Advances in Materials Science and Engineering (Jan 2019)

Effect of the Third Element Ni on the Solidification Microstructure of Undercooled Cu-40 wt.% Pb Monotectic Alloy Melt

  • Xi Hao,
  • Yugui Li,
  • Ying Hu,
  • Guihong Geng

DOI
https://doi.org/10.1155/2019/3086716
Journal volume & issue
Vol. 2019

Abstract

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In this paper, the evolution of solidification microstructure of Cu-40 wt.% Pb monotectic alloy of the third element Ni pair under deep undercooling conditions was studied. By comparing the phenomena of liquid phase separation during deep undercooling and rapid solidification of Cu-40 wt.% Pb monotectic alloy, the melt of the alloy increases with the undercooling, and the solidification structure appears uneven or even stratified. With the addition of the third element Ni, the liquid phase separation can be effectively inhibited by the change of interfacial energy. The solidified structure undergoes the transformation from coarse dendrite to the first kind of granular and refined dendrite in a wide undercooling range. When the undercooling reaches 143 K, the structure begins to show an inhomogeneous trend.