Materials Research Letters (Nov 2017)

Revealing interfacial diffusion kinetics in ultra-fine-laminated Ni with low-angle grain boundaries

  • Z. B. Wang,
  • S. V. Divinski,
  • Z. P. Luo,
  • Y. Buranova,
  • G. Wilde,
  • K. Lu

DOI
https://doi.org/10.1080/21663831.2017.1368036
Journal volume & issue
Vol. 5, no. 8
pp. 577 – 583

Abstract

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An ultra-fine-laminated (UFL) Ni sample with a high fraction of low-angle grain boundaries (LAGBs) was produced by dynamic plastic deformation. And self-diffusion behavior was studied in this material by the radio-tracer technique. Significantly enhanced interfacial diffusivity was detected in the UFL Ni in comparison with coarse-grained Ni. Analyses indicated that diffusion along LAGBs in the UFL sample is unexpectedly faster than the typical diffusion rates along conventional grain boundaries in the coarse-grained sample. This behavior is explained by the interaction of LAGBs with numerous extrinsic dislocations, as revealed by high-resolution transmission electron microscopy.

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